ITEM |
DATA |
REMARK |
Min. Line Width(Mil) |
4 |
|
Min. Space(Mil) |
4/5 |
4mil for Gold finger |
Min. pad(Mil) |
PTH: 4Mil |
The distance between the hole edge and the pad edge¡C |
Component hole¡G7Mil |
Min. hole diameter |
Board thickness< 2.0mm |
0.2mm |
Finish hole¡C |
Board thickness?2.0mm |
Aspect ratio ?6 |
Finish hole¡C |
Max. Board thickness |
Single-layer / double-layer |
3.2mm |
0 |
Multi-layer |
6.0mm |
Min. Board thickness |
Single-layer / double-layer |
0.2mm |
Multi-layer |
4 layer:0.4mm¡F6 layer:0.8mm¡F8 layer:1.0mm¡F10 layer:1.2mm |
|
The distance between the line and board edge |
Milling:0.20mm |
V-CUT: 0.4mm |
Max. layer |
16 |
Solder Mask |
Solder mask opening(Mil) |
2/4 |
1. only one side¡F2.the tolerance is within 2 mil in order to avoid the exposure of solder mask dam. |
Solder mask dam (Mil) |
6 |
Between IC pins¡C |
Color |
white, black, blue, green, yellow, red and so on |
|
Legend |
Min. space(Mil) |
5/8 |
Color |
White, yellow, black and so on |
Surface Finish |
Plating Tin¡BPlating Ni/A, ENIG and so on |
Plating layer thickness |
technology |
thickness |
Minimal thickness |
Maximal thickness |
Gold plating |
Au.thickness |
100 |
150 |
Nithickness |
1 |
3 |
ENIG |
Nithickness |
100 |
150 |
Au.thickness |
1 |
5 |
Gold finger |
Ni. thickness |
120 |
150 |
Gold thickness |
5 |
30 |
Hole copper¡]micron¡^ |
Copper thickness |
20 |
25 |
Base copper thickness |
Copper thickness of inner and out layer¡]oz¡^ |
0.5 |
6 |
Finish copper thickness |
Out layer |
1 |
6.5 |
Inner layer |
0.5 |
6 |
PP thickness(mm) |
0.06 |
---- |
Line width/space(mil) |
Max. copper thickness |
0 |
4/4(Gold finger);4/5; |
0.5oz |
0 |
The line width is not less than the required in condition of keeping the line space. |
6/7 |
1oz |
0 |
8/8 |
2oz |
0 |
8/12 |
3oz |
0 |
|
5oz |
0 |
Base material type |
FR-4; alu. Base material¡Fhigh frequency material¡FPTFE¡FFPC¡Fsuper-thick copper clad laminate¡Fpaperboard¡FBT material¡FPi material¡FRogers4003 (PPC:4403) |
|
